UHS-II SDXC Card Reader
Wi-Fi 6E (802.11ax) | Bluetooth 5.3
6 x Thunderbolt 4
2 x USB-A 3.1 Gen 1 | 1 x HDMI
1 x 10 Gigabit Ethernet Port
The M2 Ultra is built from two M2 Max dies connected through UltraFusion, which is Apple's custom-built packaging technology. UltraFusion uses a silicon interposer that connects the dies with more than 10,000 signals, providing over 2.5 TB/s of low latency interprocessor bandwidth. UltraFusion's architecture enables the M2 Ultra to appear as a single chip to software. This means code doesn't need to be rewritten to utilize the extreme performance of the M2 Ultra.